SPI

YAMAHA- YSi-SP 3D Solder Paste Inspection Machine基本規格Horizontal resolution (FOV size)1) 25μm/12.5μm(approx.50*50mm) 2) 20μm/10μm(approx.40*40mm) 3) 15μm/7.5μm(approx.30*30mm) *All are standard selecti......

YAMAHA- YSi-SP 3D Solder Paste Inspection Machine基本規格Horizontal resolution (FOV size)1) 25μm/12.5μm(approx.50*50mm) 2) 20μm/10μm(approx.40*40mm) 3) 15μm/7.5μm(approx.30*30mm) *All are standard selection type.Applicable PCBL510*W460mm to L50*W50mm(single lane spec) *No dual lane specification availableHeight resolution1μmInspection itemsSolder paste printing quality (volume, height, area and misalignment)Power supplySingle-phase AC 200/208/220/230/240 +/- 10%Air supply sourceAirless specificationExternal dimensionL904*W1,080mm*H1,478mmWeightApprox. 550kg