铜抛机-DMP/CMP

详细说明

【介绍参数】

1. 独立四电机驱动     Independent 4 Drives

_ 为方案提供更多选择     Provides much option for the best recipe

_ 图形易于修改         Easy to correct platen figure

2. 研磨盘冷却系统    Plate Cooling Structure(CMP)

_ 该结构可以很大程度上降低机械抛光过程中温度升高对砂轮平面度造成的影响

Maintain Plate flatness management against heat during mechanical polishing.

3. 低振动    Low vibration

_ 高刚性铸铁机身，减少加工震动        Provides stable run for thin applications

4. Hydrostatic base facing unit(DMP)

_ 平面度可达5um以内          Always guarantee the best flatness within 5um

_ 时间节约:尺寸自动补偿系统        Time saving : Self re-conditioning when necessary

5. 压力控制系统        Air Tube Type pressure control system

_ 加工超薄和易碎产品时可以提供更精确的压力控制

Provides the suitable pressure control for thin & fragile applications

_ 出色的压力控制系统，可将加工压力均匀分配至砂轮盘所有晶片

Excellent resolution of upper pressure Balanced pressure to all batched wafers

6. 采用德制传输系统       German made transmission applied

_ 设备耐用度有保证         Guaranteed machine durability

_ 低故障率 ，低轮齿间隙        Low trouble & Less back-lash