应用优势：15mm及以上厚玻璃异性切割
Advantages: 15mm glass special-shaped
cutting, P S O Control、
技术指标<15ps,2mJ/3.5mJ,200w
Specifications:<15ps, 2mJ/3.5mJ, 200W
厚 玻璃切割
Thick glass cutting
主要应用：消费电子、汽车、光学镜片制造等领域厚玻璃切割
Applications: Thick glass cutting inconsumer electronics, automotive, optical lens manufacturing and other fields.
技术参数
Specifications
参数Parameters | 单位Unit | GS-PIRX3 |
工作模式(WorkingMode) | 脉冲 (Pulse) | |
中心波长 (Center Wavelength) | nm | 1064±0.2 |
输出功率 (Max Optical Average Power) | W | 30/70/90/200 |
PSO功能 | 支持 | |
脉冲宽度 (Pulse Width) | ps | <15 |
输出脉冲个数 (Pulse Number) | 1-10 | |
重复频率 (Pulse Repetition Rate) | KHz | 20-500 |
偏振 (Polarization) | 线偏 (linear) | |
消光比 (Extinction Ratio) | dB | ＞ 20 |
单脉冲能量 (Max Pulse Energy) | mJ | 2 (burst3.5) |
光束质量M2(Beam Quality M2) | ≤1.3 | |
输出光斑直径 (Collimated Beam Diameter) | mm | 1.6±0.3 |
输出光功率可调范围 (Output Power Tunability) | % | 0-100 |
功率稳定度 (Power Stability) | % | <1 |
传 输线缆长度 (Cable Lenth) | m | 2.5 |
工作环境Working Conditions | ||
功率消耗 (Power Consumption) | W | 2000 |
工作电压 (Electrical Supply Voltage) | VDC | 220 |
工作温度 (Operating Temperature) | °C | 20to30 |
存储温度 (c | °C | 0to50 |
体积 (Dimensions)(LxWxH) | mm | 900x420x208 |
重量 (Weight) | kg | 100 |
