3w红外皮秒光纤激光器GS-PIR3系列(MiniLED)
3w Infrared Picosecond Fiber Laser GS-PIR3 Series
概述 Introduction
应用优势：单/双头输出，晶圆IR良率高, 12um窄切割道
Advantages: Single/Double head output, LED wafer dicing, High IR yield, 12um narrow street width
技术指标：<15ps, 3w, 50K-200k
Specifications: <15ps, 3w, 50K-200k
主要应用：MiniLED、硅、碳化硅等脆性材料切割
Applications: LED Sapphire, Si, Sic and so on brittle material cutting
MiniLED划片
Wafer dicing/LED sapphire dicing
技术参数 Specifications
参数 Parameters | 单位 Unit | GS-PIR3/PIR4D |
工作模式 (Working Mode) | 脉冲 (Pulse) | |
中心波长 (Center Wavelength) | nm | 1027-1040 |
输出功率 (Max Optical Average Power) | W | 3、4（单路2） |
典型输出功率 (Typical Output Power) | W | 3@100KHz |
脉冲宽度 (Pulse Width) | ps | <15 |
输出脉冲个数 (Pulse Number) | 6-13 | |
重复频率 (Pulse Repetition Rate) | KHz | 50-200 |
偏振 (Polarization) | 线偏 (linear) | |
消光比 (Extinction Ratio) | dB | ＞ 20 |
脉冲串能量 (Max Pulse train Energy) | uJ | 30 |
光束质量M2(Beam Quality M2) | ≤1.2 | |
输出光斑直径 (Collimated Beam Diameter) | mm | 5.5±0.3 |
输出光功率可调范围 (Output Power Tunability) | % | 0-100 |
功率稳定度 (Power Consumption) | % | <1 |
传递光纤长度 (Delivering Fiber Length) | m | 1 |
工作环境 Working Conditions | ||
功率消耗 (Power Consumption) | W | 240 |
工作电压 (Electrical Supply Voltage) | VDC | 24 |
工作温度 (Operating Temperature) | °C | 20to30 |
存储温度 (Storage Temperature) | °C | 0to50 |
体积 (Dimensions)(LxWxH) | mm | 612x430x223 |
重量 (Weight) | kg | 45 |
* 本产品可以根据客户要求定制
* Above specifications can be customized for your specific application.
订购信息 Ordering Information
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