精密双端面研磨抛光机YH2M13B-9L技术参数：Technical spec:
| 项目 Item | YH2M13B-9L |
| 研磨盘尺寸Lapping plate size（外径ODx内径IDx厚度THK）(mm) | φ978xφ558x45 |
| 行星轮规格Planetary wheel spec | DP=12 Z=108 |
| 放置行星轮个数n Planetary Wheel Qty | 3≤n≤9 |
| 加工件zui大尺寸(mm)The max workpiece size | 200(矩形对线Rectangle diagonal 200mm） |
| 加工件zui小厚度尺寸(mm)The min THK | 0.4 |
| 研磨件zui高平面度(mm)Lapping workpice flatness | ≤0.008mm（φ200） |
| 抛光件zui高平面度Polishing workpice flatness | ≤0.005mm（φ200） |
| 研磨件表面粗糙度Lapping workpice roughness | ≤Ra0.15μm |
| 抛光件表面粗糙度Polishing workpiece roughness | ≤Ra0.125μm |
| 外形尺寸（约：长x宽x高）Size(L*W*H)(mm) | 1650x1300x2650 |
| 整机重量（约）Weight(Kg) | 2600 |
精密双端面研磨抛光机YH2M13B-9L技术特点：Technical characteristics:
1.本机属于四道行星轮系运动原理的研磨（抛光）机床。
2.本机采用内齿圈升降方式。升降气缸推动螺旋凸轮带动齿圈升降。升降气缸由装在设备右侧的三位手动阀控制，齿圈的行程可以调节.
3.本机采用双电机拖动。主电机通过一系列变速带动上磨盘、下磨盘、内齿圈转动。而太阳轮则由副电机带动。主电机与副电机均为变频调速。下磨盘、内齿圈、太阳轮转动方向*，上磨盘则做相反转动。
4.本机配有安全自锁气缸，当上研磨（抛光）盘上升到上限位点时，插板伸出，防止上研磨（抛光）盘落下，确保操作者、设备安全。
5.本机采用PLC控制，控制方式灵活可靠。
6.本机采用触摸屏作为人机界面显示报警和机床状态的实时信息，界面友好，信息量大。
1.The machine is according to four planetary gears motion principle.
2.This machine adopts the way of the inner gear ring lifting. The cylinder pushes spiral cam to drive the ring gear lift when it ups and downs. It is controlled by a three manual valve device which is installed in the right side. The gear ring can be adjusted.
3.Double motor driving. The main motor drives the upper lapping plate, the lower lapping plate and the inner gear ring to rotate by a series of variable speed, And the sunwheel is driven by the auxiliary motor. Both the main motor and the auxiliary motor are frequency conversion. The lower lapping plate, inner ring gear and the sun wheel rotate in the same direction, but the upper lapping plate opposite.
4.The machine is equipped with safety lock cylinder, when the upper lapping rises to the up limitation, the inserting plate comes out to prevent it falling down so that ensure the operator and equipment safety.
5.PLC control is flexible and reliable.
6.It adopts touch screen as man-machine interface device, which displays the alarm and in real time information of machine status, it is very friendly and with large amount of information.
YH2M13B-9L主要用途：The main purposes:
本设备主要用于硅片、蓝宝石晶体、陶瓷片、光学玻璃、石英晶体、手机屏幕玻璃、其它半导体材料等非金属和金属的硬脆性材料薄形精密零件的上、下两平行端面的同时研磨和抛光。
This equipment is mainly used for lapping and polishing both sides of the parallel surface of thin metal and hard brittle nonmetal parts, such as silicon, sapphire crystal, ceramic, optical glass, quartz crystal and other semiconductor materials.
