IC晶圆半导体自动激光切割机—— IC Wafer Semiconductor Automatic Laser Cutting Machine

加工优势 1. 激光划片属于非接触式加工，可以避免出现芯片破碎和其它损坏现象2. 采用的高光束质量的光纤激光器对芯片的电性影响小，可提高的划片成品率3. 激光划片速度快，高达300mm/s；4. 激光可以对不同厚度与大小的晶圆进行作业，具有更好的兼容性和通用性；5. 激光划片不需要去离子水，不存在刀具磨损问题，并可连续24小时作业。ADVANTAGES1. Laser scribin......

加工优势 1. 激光划片属于非接触式加工，可以避免出现芯片破碎和其它损坏现象2. 采用的高光束质量的光纤激光器对芯片的电性影响小，可提高的划片成品率3. 激光划片速度快，高达300mm/s；4. 激光可以对不同厚度与大小的晶圆进行作业，具有更好的兼容性和通用性；5. 激光划片不需要去离子水，不存在刀具磨损问题，并可连续24小时作业。ADVANTAGES1. Laser scribing belongs to non-contact processing, which can avoid chip breakage and other damage.2. The high beam quality fiber laser used has little influence on the chip's electrical properties and can improve the dicing yield.3. Laser scribing speed is up to 300 mm/s.4. Lasers can work on wafers of different thickness and size, which has better compatibility and versatility.5. Laser dicing does not need for deionized water, does not have tool wear problem, and can be operated continuously for 24 hours.