详细介绍
应用领域及适用范围:
主要用于多晶硅的磨方、倒角、磨面,单晶硅的磨面、滚圆。
Application
Mainly used for flat grinding and chamfering of polycrystalline silicon; flat and cylindrical grinding monocrystalline silicon.
主要特点:
高速高效磨削、使用寿命长、材料去除效率高、加工工件表面损伤层低、光洁度高。
Characteristics:
High speed and high efficiency grinding,long life span, high efficiency on stock removal, less damage and good finish of workpiece surface.
产品规格Specification