| 型号 Type | MLF500-6015SGII/MLF750-6015SGII/MLF1200-6015SGII |
加工尺寸(幅面可选)
Working size | 6000mm x 1500mm | 重复定位精度
Repositioning accuracy | ≤±0.02mm |
激光波长
Laser wavelength | 1070nm | 小切缝
Min cutting seam | 0.10mm |
激光器功率
Laser power | 500W/700W/1200W | 大切割速度
Max cutting speed | 12m/min 22m/min |
大切割厚度
Max cutting thicknes | 6mm/10mm/12mm | 制冷方式
Cooling system | 水冷
Cooling system |
整机大功率消耗
Max consumption power | ≤15KW | 电力配置
Power manage system | 380V 士5%/50HZ |
几何定位精度
Geometric positioning accuracy | ≤±0.03mm/m | 连续工作时间
Continuous working time | ≥20小时 |
设备外型尺寸
Size of the unit | 7500x2260x1470mm | 机珠运行环境(温度、湿度)
Working environment (Temp, humidity) | ≤40℃ 10-30% |
台面承载重量
Mesa carries weight | 300kg | 大加速度:
Max acceleration | 0.8-1.0G |
